Portfolio In Intelligence Industry

  • PCB Assembly
    • Protection and potting on memory card, anti-vibration with waterproofing on AIOT cable, reinforced bonding on FPCB, and thermal dissipation thin film.
  • Main body structure and trim part
    • Structure bonding, frame sealing, gap filling,
      waterproofing, scratch resistance and thermal radiation coating.

Epoxy Adhesive

播放 Cured epoxy delivers perfectly physical and chemical performance, reliable assembly strength on metal and dissimilar substrates. In addition to the dielectric, low shrinkage, toughness

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Nano Thermal Thin Film

The form factors of upcoming electronics design are higher speed transmission, faster computing, high power supply, smaller space of PCB and housing. However, this generates

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PCBA Functional Coating

PCBA functional coating (protection and EMI shielding) 5G, Wi-Fi, RF, Noise Prevention, AI are form factors for thin Smart Folded Phone, Smart watch, Flexible PCB

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PU Reactive Hotmelt (PUR)

With easy operation, permanent bonding, high productivity and cost competency, PUR is widely used for sneaker, textile, and furniture lamination.Further feature include flexibility, oil proofing,

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Functional composite coating

General and nano grade Thermal radiation Heat isolation EMI shielding Anti-dust Chemical resistance, -acid and alkalineUV-cut, reflection Anti-scratch, hardness >3H Feature Thermal radiation Heat isolation

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Dichtol HTR HS

Thermal radiation Heat isolation EMI shielding Anti-dust Chemical resistance, -acid and alkalineUV-cut, reflection Anti-scratch, hardness >3H Feature Thermal radiation Heat isolation EMI shielding Anti-dust Chemical

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