In the trend of shorter development cycle and multi-function with limited dimension on electronics device, ARSCO provides several thermal dissipation materials with value added proposal for specific application.
ARSCO aims to one-stop package solution from customer’s design stage to launch production.
|Thermal management |
|Bonding Strength||Gap Filling||Rework ability||Reliability|
|Solid Gasket Series||O||X||O||O||V|
|Liquid Gel Series||V||O||V||V||V|
V= Good O= OK X= Poor
ARSCO strives for total solutions provider on diverse requirements.
Please contact us for any inquiry.