Thermal Management Materials – Comprehensive Scenario Analysis

In the trend of shorter development cycle and multi-function with limited dimension on electronics device, ARSCO provides several thermal dissipation materials with value added proposal for specific application.

ARSCO aims to one-stop package solution from customer’s design stage to launch production.

Thermal management
Bonding StrengthGap FillingRework abilityReliability
Solid Gasket SeriesOXOOV
Liquid Gel SeriesVOVVV

V= Good O= OK X= Poor

ARSCO strives for total solutions provider on diverse requirements.

Please contact us for any inquiry.