In the trend of shorter development cycle and multi-function with limited dimension on electronics device, ARSCO provides several thermal dissipation materials with value added proposal for specific application.
ARSCO aims to one-stop package solution from customer’s design stage to launch production.
| Thermal management Efficiency | Bonding Strength | Gap Filling | Rework ability | Reliability | |
|---|---|---|---|---|---|
| Solid Gasket Series | O | X | O | O | V |
| Liquid Gel Series | V | O | V | V | V |
V= Good O= OK X= Poor
ARSCO strives for total solutions provider on diverse requirements.
Please contact us for any inquiry.