Semiconductor
With our 20 years of experience, we will effectively help you to upgrade in your product design and market expansion!
100% are developed and manufactured in Taiwan, where strive for supports to semiconductor manufacturers .
Backside protection film
Wafer Protection Film
Scope of application
SiP, WLP, WLCSP, Flip-chip, Stacked die, Fan-out, Fan-in, SAW.., advanced package etc.
Thinning wafer.
Sheet & Film type of package material
Molding Sheet & Film Series For Wafer Package
Scope of application
SiP, WLP, WLCSP, Flip-chip, Stacked die,Fan-out, Fan-in, SAW, MUF (molding underfill).., advanced package etc.
Warpage controlling film
Wafer Warpage Control Film
Scope of application
Advanced package process, heterogeneous & 3D IC, wafer level package, panel level package.
3D IC transparent film for package
Advanced Package Process / 3D IC / MUF
Scope of application
Advanced package process, heterogeneous & 3D IC, MUF, Mini & Micro LED package.
TBF built-up film
Insulating & Stack-up
Taiwan Built- Up Film TBF®
Scope of application
Carrier or substrate of flip-chip and next generation of required low CTE, Low Dk & Df