Semiconductor

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Wafer Protection Film series perform muti-function as backside protection for wafer.
100% are developed and manufactured in Taiwan, where strive for supports to semiconductor manufacturers .

Backside protection film

Wafer Protection Film

Scope of application

SiP, WLP, WLCSP, Flip-chip, Stacked die, Fan-out, Fan-in, SAW.., advanced package etc.

Thinning wafer.

Contributed by fast development of 5G networks, AI, Auto Drive, intelligent mobile terminals, and the Internet of Things, according to Accenture, the market size of global 5G chip will reach 22.41 billion US dollars by 2026, providing good development opportunities for packaging material market.

Sheet & Film type of package material

Molding Sheet & Film Series For Wafer Package

Scope of application

SiP, WLP, WLCSP, Flip-chip, Stacked die,Fan-out, Fan-in, SAW, MUF (molding underfill).., advanced package etc.

Best practice solutions for wafer protection and Fan-Out warpage controlling

Warpage controlling film

Wafer Warpage Control Film

Scope of application

Advanced package process, heterogeneous & 3D IC, wafer level package, panel level package.

The transparent feature reveals the ease than typical black film, enabling to precisely position the chips in stack-up

3D IC transparent film for package

Advanced Package Process / 3D IC / MUF

Scope of application

Advanced package process, heterogeneous & 3D IC, MUF, Mini & Micro LED package.

In reflection to miniaturization and multi-function design, the carrier and substrate package with significant materials play as the key roles for the integration of SOC and reliability of efficient computing.

TBF built-up film

Insulating & Stack-up
Taiwan Built- Up Film TBF®

Scope of application

Carrier or substrate of flip-chip and next generation of required low CTE, Low Dk & Df