Intelligence Industry
We target on general industrial, consumer and automotive electronics, medical and optical grade fields to provide 3D printing equipment and materials to accelerate the efficiency of new product research and development, and also to provide innovative adhesives for assembly, functional protective coatings, and heat dissipation materials to upgrade the effectiveness and efficiency of production.

3D printing equipment and material
Scope of application
High resolution and great appearance.
Faster printing speed.
Low infrastructure cost.
Easy change over for managing multiple materials for the same equipment.
Broad range of high-performance materials including high impact resistance, toughness, and high temp resistance etc.

Structure bonding, sealant and coating with waterproofing, scratch resistance, and thermal radiation.
Scope of application
Intelligent folded phone, smartwatch, 3D AR glasses, multi-function camera, and other electronic devices with application for housing assembly, water-proofing, scratch resistance, protection film.., etc.
PCBA assembly solution in addition to sweat and seawater proofing, EMI shielding., etc.

Ex: Tread locking and sealing on SUS pipe to alloy fitting to prevent from pneumatic and hydraulic leakage.
Functional structural adhesive and sealant
Scope of application
The value proposition with product solutions for smart TV, intelligent white goods, AR glasses, TWS earphone.., etc.
Solutions for wearable devices. Thermally conductive materials that protect electronics from the environment, improve reliability, facilitate heat transfer, and strong, thin structural adhesives. constitute a comprehensive solution.
Thermal dissipation material for electronic components
Scope of application
Thermal dissipation module for server, in-can of semiconductor, and heat generator of electronics device.
Encapsulant and functional coating
Scope of application
Total solution from structure bonding, frame sealing, thermal interface material, noise prevention for sensor, connecting port, and signal transceiver of networking PCBA.
Bonding and sealing
Scope of application
PCB assembly
- Protection and potting on memory card, anti-vibration with waterproofing on AIOT cable, reinforced bonding on FPCB, and thermal dissipation thin film
Main body structure and trim part
- Structure bonding, frame sealing, gap filling, waterproofing, scratch resistance and thermal radiation coating.

Thermal dissipation material
Scope of application
pad and sheet of thermal patch, silicone based, tape and liquid gel of thermal grease, adhesive, potting gel.
Upgraded protection coating and EMI shielding coating
Scope of application
Package solution including components’ assembly, PCB, peripheral assembly, and thermal management.
Best practice to fulfill the functionality and reliability, EMI shielding, miniaturized design and assembly productivity.
Apply for potting, bonding and sealing with ISO 10993 medical certificate
Medical grade adhesive
Scope of application
The next generation of adhesives perform reliable.
Quality with cost saving for the injection needle, catheter, cusion mask of disposable devices.
General industry and automobile electronics
Scope of application
Generator, computing controller, functional sensor, ADAS system, and LED lamp.